Faculty
Dr. Guobiao (George) Zhang, currently is research professor at the School of Microelectronics, Southern University of Science and Technology, and the executive director of Engineering Research Center of Three Dimensional Integration in Guangdong Province. He received a Ph.D degree in Physics from the University of California, Berkeley (1995) under Chenming Hu. He has worked in the semiconductor field for more than 20 years. Dr. Zhang is a pioneer in 3-D integration, including 3-D memory and 3-D computing. He owns >180 patents (>120 US patents and >60 Chinese patents). Under a license from Dr. Zhang, Matrix Semiconductor mass-produced a first 3-D memory in the industry. Intel`s 3D-XPoint and YMTC`s Xtacking used Dr. Zhang`s patents. Dr. Zhang and the team won championship in the Electronic Information Industry category during the 4th National Innovation and Entrepreneurship Competition - the highest-level Innovation and Entrepreneurship Competition in China.
Hiring
Prof. Guobiao (George) Zhang welcomes individuals passionate in research to join his research group. He has openings for Research Assistant Professor, Postdoctoral Fellows, Research Assistants, Graduate Students, as well as Internships. Interested individuals are invited to email a copy of his/her CV to his email address, with subject titled “Research position application <Position, Name>”.
Contact：[email protected]
Educational Background
1990 to 1995, University of California, Berkeley, Physics, PhD
1986 to 1990, Juvenile Class, University of Science and Technology of China, Modern physics, Bachelor
Professional Experience
2019 to present, Southern University of Science and Technology, Research Professor
2001 to 2019, 3D-ROM Company, USA, Principal Scientist
1996 to 2001, ,Texas Instruments, Senior Design Engineer
Awards
Championship in the Electronic Information Industry category during the 4th National Innovation and Entrepreneurship Competition - the highest-level Innovation and Entrepreneurship Competition in China
Research Interest
3-D integration, including 3-D memory and 3-D computing
Representative licensed patent
1． US 11,068,771，2021/7/20，Integrated Neuro-Processor Comprising Three-Dimensional Memory，Guobiao ZHANG
2．US 11,055,606，2021/7/6，Vertically Integrated Neuro-Processor，Guobiao ZHANG
3．ZL 201710130887.X ，2021/6/18，含有三維存儲陣列的分布式模式處理器，張國飆
4．US 10,937,834，2021/3/2，Shared Three-Dimensional Vertical Memory，Guobiao ZHANG
5．ZL 201710241669.3，2021/1/8，含有三維存儲陣列的處理器，張國飆,沈忱
6．US 10,848,158，2020/11/24，Configurable Processor，Guobiao ZHANG
7．ZL 201710461236.9，2020/11/10，兼具數(shù)據(jù)分析功能的大數(shù)據(jù)存儲器，張國飆
8．ZL 201710460367.5，2020/11/10，兼具圖像識別功能的存儲器，張國飆
9．US 10,763,861，2020/9/1，Processor Comprising Three-Dimensional Memory (3D-M) Array, Guobiao ZHANG, Chen SHEN
10．US 10,560,475，2020/2/11，Processor for Enhancing Network Security，Guobiao ZHANG
11．10,489,590，2019/11/26，Processor for Enhancing Computer Security，Guobiao ZHANG
12．ZL 201510226777.4，2018/10/19 ，電壓產(chǎn)生器分離的三維縱向存儲器，張國飆
13．ZL 201510228946.8，2018/10/19，地址/數(shù)據(jù)轉換器分離的三維縱向存儲器，張國飆
14．US 9,838,021，2017/12/5，Configurable Gate Array Based on Three-Dimensional Writable Memory，Guobiao ZHANG
15．ZL 201510090124.8，2017/11/10，緊湊型三維存儲器，張國飆
16．US 9,666,641，2017/5/30，Compact Three-Dimensional Memory，Guobiao ZHANG
17．ZL 201280042089.7，2016/3/30，分離的三維存儲器，張國飆
18．ZL 201310091513.3，2015/9/2，小晶粒三維存儲器，張國飆
19．US 9,123,393，2015/9/1，Discrete Three-Dimensional Vertical Memory，Guobiao ZHANG
20．US 7,386,652，2008/6/10，User-Configurable Pre-Recorded Memory，Guobiao ZHANG
21．ZL 01129103.6，2008/5/14，三維只讀存儲器集成電路，張國飆
22．ZL 02131089.0，2006/11/15，三維集成存儲器，張國飆
23．US 6,717,222，2004/4/6，Three-dimensional memory，Guobiao ZHANG
24．ZL 98119572.5，2003/1/22，三維只讀存儲器及其制造方法，張國飆
25．US 5,835,396，1998/11/10，Three-dimensional read-only memory，Guobiao ZHANG